Logic Gates 74AUP1G97GX/X2SON6/REEL 7" Q2/
| Parameter Name | Attribute value |
| Product Attribute | Attribute Value |
| Manufacturer | NXP |
| Product Category | Logic Gates |
| RoHS | Details |
| Mounting Style | SMD/SMT |
| Package / Case | X2SON-6 |
| Packaging | Reel |
| Factory Pack Quantity | 10000 |
| 74AUP1G97GXZ | 74AUP1G97GS,132 | 74AUP1G97GW,125 | 74AUP1G97GF,132 | 74AUP1G97GW | |
|---|---|---|---|---|---|
| Description | Logic Gates 74AUP1G97GX/X2SON6/REEL 7" Q2/ | Logic Gates CONFIG 4.6 V 20 mA | Logic Gates 1.8V LOW POW CNFIG | Logic Gates 1.8V LOW POW CNFIG | Logic Gates |
| Brand Name | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to |
| Maker | - | NXP | NXP | NXP | NXP |
| package instruction | - | VSON, SOLCC6,.04,14 | TSSOP, TSSOP6,.08 | VSON, SOLCC6,.04,14 | PLASTIC, SOT-363, SC-88, 6 PIN |
| Manufacturer packaging code | - | SOT1202 | SOT363 | SOT891 | - |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| series | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 code | - | S-PDSO-N6 | R-PDSO-G6 | S-PDSO-N6 | R-PDSO-G6 |
| JESD-609 code | - | e3 | e3 | e3 | e3 |
| length | - | 1 mm | 2 mm | 1 mm | 2 mm |
| Load capacitance (CL) | - | 30 pF | 30 pF | 30 pF | - |
| Logic integrated circuit type | - | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| MaximumI(ol) | - | 0.0017 A | 0.0017 A | 0.0017 A | - |
| Humidity sensitivity level | - | 1 | 1 | 1 | 1 |
| Number of functions | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 6 | 6 | 6 | 6 |
| Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | VSON | TSSOP | VSON | TSSOP |
| Encapsulate equivalent code | - | SOLCC6,.04,14 | TSSOP6,.08 | SOLCC6,.04,14 | - |
| Package shape | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | 260 | 260 | 260 |
| power supply | - | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | - |
| Prop。Delay @ Nom-Sup | - | 22.2 ns | 22.2 ns | 22.2 ns | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | - | YES | YES | YES | - |
| Maximum seat height | - | 0.35 mm | 1.1 mm | 0.5 mm | 1.1 mm |
| Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| Nominal supply voltage (Vsup) | - | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| surface mount | - | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | - | NO LEAD | GULL WING | NO LEAD | GULL WING |
| Terminal pitch | - | 0.35 mm | 0.65 mm | 0.35 mm | 0.65 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | 30 | 30 | 30 |
| width | - | 1 mm | 1.25 mm | 1 mm | 1.25 mm |
| Parts packaging code | - | - | TSSOP | SON | SOT-363 |
| Contacts | - | - | 6 | 6 | 6 |
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