Parameter Name | Attribute value |
Brand Name | Freescale |
Is it lead-free? | Contains lead |
Is it Rohs certified? | conform to |
Maker | NXP |
package instruction | FLATPACK, R-PDFP-F2 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Shell connection | SOURCE |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 133 V |
FET technology | METAL-OXIDE SEMICONDUCTOR |
Maximum feedback capacitance (Crss) | 0.26 pF |
highest frequency band | L BAND |
JEDEC-95 code | TO-270AA |
JESD-30 code | R-PDFP-F2 |
JESD-609 code | e3 |
Humidity sensitivity level | 3 |
Number of components | 1 |
Number of terminals | 2 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 225 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 260 |
Polarity/channel type | N-CHANNEL |
Minimum power gain (Gp) | 24 dB |
surface mount | YES |
Terminal surface | Matte Tin (Sn) |
Terminal form | FLAT |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
transistor applications | AMPLIFIER |
Transistor component materials | SILICON |