|
MC74ACT157DR2G |
MC74ACT157DTR2G |
MC74AC157DR2G |
MC74ACT157DG |
MC74AC157DTR2G |
Description |
Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Input |
Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Input |
Encoders, Decoders, Multiplexers & Demultiplexers 2-6V Quad 2-Input |
Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Input |
Encoders, Decoders, Multiplexers & Demultiplexers 2-6V Quad 2-Input |
Brand Name |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
SOIC |
TSSOP |
SOIC |
SOIC |
TSSOP |
package instruction |
SOP, SOP16,.25 |
TSSOP, TSSOP16,.25 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
TSSOP, TSSOP16,.25 |
Contacts |
16 |
16 |
16 |
16 |
16 |
Manufacturer packaging code |
751B-05 |
948F-01 |
751B-05 |
751B-05 |
948F-01 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
series |
ACT |
ACT |
AC |
ACT |
AC |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e3 |
e4 |
e3 |
e3 |
e4 |
length |
9.9 mm |
5 mm |
9.9 mm |
9.9 mm |
5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
MULTIPLEXER |
MULTIPLEXER |
MULTIPLEXER |
MULTIPLEXER |
MULTIPLEXER |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
Number of entries |
2 |
2 |
2 |
2 |
2 |
Output times |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
TSSOP |
SOP |
SOP |
TSSOP |
Encapsulate equivalent code |
SOP16,.25 |
TSSOP16,.25 |
SOP16,.25 |
SOP16,.25 |
TSSOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TR |
TR |
TR |
RAIL |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
5 V |
5 V |
3.3/5 V |
5 V |
3.3/5 V |
Maximum supply current (ICC) |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
propagation delay (tpd) |
10 ns |
10 ns |
13 ns |
10 ns |
13 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.2 mm |
1.75 mm |
1.75 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
6 V |
5.5 V |
6 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
2 V |
4.5 V |
2 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin (Sn) |
Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
1.27 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
40 |
width |
3.9 mm |
4.4 mm |
3.9 mm |
3.9 mm |
4.4 mm |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
- |
Factory Lead Time |
35 weeks |
1 week |
- |
1 week |
- |
Is Samacsys |
N |
- |
N |
N |
N |
Base Number Matches |
1 |
- |
1 |
1 |
1 |