TC74AC245FT datasheet, PDF - EEWORLD Datasheet

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TC74AC245FT: DescriptionCMOS Digital Integrated Circuit Silicon Monolithic; Categorylogic logic; File Size224KB，9 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC74AC245FT Overview

CMOS Digital Integrated Circuit Silicon Monolithic

TC74AC245FT Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP20,.25
Contacts	20
Reach Compliance Code	unknow
Control type	COMMON CONTROL
Counting direction	BIDIRECTIONAL
series	AC
JESD-30 code	R-PDSO-G20
length	6.5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS TRANSCEIVER
MaximumI(ol)	0.024 A
Number of digits	8
Number of functions	1
Number of ports	2
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP20,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5 V
Prop。Delay @ Nom-Su	12.4 ns
propagation delay (tpd)	12.4 ns
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
translate	N/A
width	4.4 mm

TC74AC245FT Related Products

	TC74AC245FT	TC74AC245F	TC74AC245P	TC74AC245P_07	TC74AC640P	TC74AC640FT	TC74AC640F
Description	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic
Is it Rohs certified?	conform to	conform to	conform to	-	conform to	conform to	conform to
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	-	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Parts packaging code	TSSOP	SOIC	DIP	-	DIP	TSSOP	SOIC
package instruction	TSSOP, TSSOP20,.25	SOP, SOP20,.3	DIP, DIP20,.3	-	0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-20	TSSOP, TSSOP20,.25	SOP, SOP20,.3
Contacts	20	20	20	-	20	20	20
Reach Compliance Code	unknow	unknow	unknow	-	unknow	unknow	unknow
Control type	COMMON CONTROL	COMMON CONTROL	COMMON CONTROL	-	-	COMMON CONTROL	COMMON CONTROL
Counting direction	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	-	-	BIDIRECTIONAL	BIDIRECTIONAL
series	AC	AC	AC	-	AC	AC	AC
JESD-30 code	R-PDSO-G20	R-PDSO-G20	R-PDIP-T20	-	R-PDIP-T20	R-PDSO-G20	R-PDSO-G20
length	6.5 mm	12.8 mm	24.6 mm	-	24.6 mm	6.5 mm	12.8 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	-	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	-	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER
MaximumI(ol)	0.024 A	0.024 A	0.024 A	-	-	0.024 A	0.024 A
Number of digits	8	8	8	-	8	8	8
Number of functions	1	1	1	-	1	1	1
Number of ports	2	2	2	-	2	2	2
Number of terminals	20	20	20	-	20	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	-	INVERTED	INVERTED	INVERTED
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOP	DIP	-	DIP	TSSOP	SOP
Encapsulate equivalent code	TSSOP20,.25	SOP20,.3	DIP20,.3	-	-	TSSOP20,.25	SOP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	-	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	240	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3/5 V	3.3/5 V	3.3/5 V	-	-	3.3/5 V	3.3/5 V
Prop。Delay @ Nom-Su	12.4 ns	12.4 ns	12.4 ns	-	-	11.4 ns	11.4 ns
propagation delay (tpd)	12.4 ns	12.4 ns	12.4 ns	-	11.4 ns	11.4 ns	11.4 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.9 mm	4.45 mm	-	4.45 mm	1.2 mm	1.9 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	-	2 V	2 V	2 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	NO	-	NO	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	-	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	0.65 mm	1.27 mm	2.54 mm	-	2.54 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
translate	N/A	N/A	N/A	-	-	N/A	N/A
width	4.4 mm	5.3 mm	7.62 mm	-	7.62 mm	4.4 mm	5.3 mm

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