Two-Wire Serial EEPROM 16K (2048 x 8)
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Atmel (Microchip) |
| Parts packaging code | DIP |
| package instruction | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 |
| Contacts | 8 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Other features | 2-WIRE SERIAL INTERFACE |
| Maximum clock frequency (fCLK) | 0.1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1DDDMMMR |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e3 |
| length | 9.271 mm |
| memory density | 16384 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2KX8 |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.334 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000018 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | HARDWARE |
| Base Number Matches | 1 |
| AT24C164-10PU-2.7 | AT24C164-10PU-1.8 | AT24C164-10SU-2.7 | AT24C164_06 | AT24C164-W1.8-11 | AT24C164-W2.7-11 | AT24C164-10SU-1.8 | |
|---|---|---|---|---|---|---|---|
| Description | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) | Two-Wire Serial EEPROM 16K (2048 x 8) |
| Is it lead-free? | Lead free | Lead free | Lead free | - | - | - | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | - | - | - | conform to |
| Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | DIP | DIP | SOIC | - | DIE | DIE | SOIC |
| package instruction | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | - | DIE, | DIE, | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 |
| Contacts | 8 | 8 | 8 | - | - | - | 8 |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | - | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| Data retention time - minimum | 100 | 100 | 100 | - | - | - | 100 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - | - | 1000000 Write/Erase Cycles |
| I2C control byte | 1DDDMMMR | 1DDDMMMR | 1DDDMMMR | - | - | - | 1DDDMMMR |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | - | X-XUUC-N | X-XUUC-N | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | - | - | - | e3 |
| length | 9.271 mm | 9.271 mm | 4.9 mm | - | - | - | 4.9 mm |
| memory density | 16384 bi | 16384 bi | 16384 bi | - | 16384 bi | 16384 bi | 16384 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | - | 8 | 8 | 8 |
| Humidity sensitivity level | 1 | 1 | 1 | - | - | - | 1 |
| Number of functions | 1 | 1 | 1 | - | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | - | - | - | 8 |
| word count | 2048 words | 2048 words | 2048 words | - | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | - | 2000 | 2000 | 2000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | - | 2KX8 | 2KX8 | 2KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | - | DIE | DIE | SOP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | SOP8,.25 | - | - | - | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | - | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 260 | - | - | - | 260 |
| power supply | 5 V | 2/5 V | 5 V | - | - | - | 2/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.334 mm | 5.334 mm | 1.75 mm | - | - | - | 1.75 mm |
| Serial bus type | I2C | I2C | I2C | - | I2C | I2C | I2C |
| Maximum standby current | 0.000018 A | 0.000003 A | 0.000018 A | - | - | - | 0.000003 A |
| Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | - | - | - | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 1.8 V | 2.7 V | - | 1.8 V | 2.7 V | 1.8 V |
| Nominal supply voltage (Vsup) | 3 V | 2.5 V | 3 V | - | 2.5 V | 3 V | 2.5 V |
| surface mount | NO | NO | YES | - | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | NO LEAD | NO LEAD | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | - | - | - | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | - | UPPER | UPPER | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 40 | - | - | - | 40 |
| width | 7.62 mm | 7.62 mm | 3.9 mm | - | - | - | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | - | 10 ms | 10 ms | 10 ms |
| write protect | HARDWARE | HARDWARE | HARDWARE | - | - | - | HARDWARE |
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