830-90-020-30-002000 datasheet, PDF

830-90-020-30-002000: DescriptionHeaders & Wire Housings; CategoryThe connector The connector; File Size521KB，1 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

Download Datasheet Parametric View All

830-90-020-30-002000 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	830-90-020-30-002000	-	-	View	Buy Now

Headers & Wire Housings

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mill-Max
Reach Compliance Code	compliant
Connector type	BOARD CONNECTOR
Contact to complete cooperation	TIN LEAD (200) OVER NICKEL (150)
Contact completed and terminated	TIN LEAD (200) OVER NICKEL (150)
Contact point gender	MALE
Contact material	NOT SPECIFIED
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e0
MIL compliance	NO
Manufacturer's serial number	830
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	1
Options	GENERAL PURPOSE
Terminal pitch	2 mm
Termination type	SURFACE MOUNT
Total number of contacts	20

Technical Science: The Essential Differences between DRAM and NAND: DRAM is one of the storage devices we deal with every day. You may be unfamiliar with the abbreviation of DRAM, which means dynamic random access memory in Chinese. To enhance your understanding of DR...; eric_wang Embedded System

STM32F205 series MCU OTP problem: Help, does anyone know what this OTP function is for? If there is data in it, will it affect the use of ROM programs?...; jack小黑 stm32/stm8

《GaN Transistors for Efficient Power Conversion》: Who has this book? "Chinese" 《GaN Transistors for Efficient Power Conversion》...; btty038 RF/Wirelessly

Pad hole attribute problem: [If you don't understand, ask] The picture to be drawn is the size and shape of the holes and pads of the DIP package. There are three arrows in this column as shown in the figure below. What do they ...; shaorc PCB Design

Power Amplifier Modules and Their Role in 5G Designs: 5G is one of the most important and powerful technologies ever introduced to the wireless communications market. With significant improvements in data rate, latency, and capacity compared to 4G, 5G is...; 兰博 RF/Wirelessly

Learn more about the SimpleLink MCU Platform Tools and Development Kits (Rev. B): Today, the Internet of Things (IoT) market is more competitive than ever. End users demand more functionality and features while expecting lower cost and size without compromising battery life. Soluti...; Jacktang Wireless Connectivity

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components