IC EEPROM 256KBIT 10MHZ 8SOIC
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| package instruction | SOIC-8 |
| Reach Compliance Code | unknown |
| Maximum clock frequency (fCLK) | 10 MHz |
| JESD-30 code | R-PDSO-G8 |
| length | 4.925 mm |
| memory density | 262144 bit |
| Memory IC Type | EEPROM |
| memory width | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX1 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Maximum seat height | 1.75 mm |
| Serial bus type | SPI |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 3.9 mm |
| Base Number Matches | 1 |
| RM25C256C-LSNI-B | RM25C256C-LMAI-T | RM25C256C-LSNI-T | RM25C256C-LTAI-B | |
|---|---|---|---|---|
| Description | IC EEPROM 256KBIT 10MHZ 8SOIC | IC EEPROM 256KBIT 10MHZ 8DFN | IC EEPROM 256KBIT 10MHZ 8SOIC | IC EEPROM 256KBIT 10MHZ 8TSSOP |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| package instruction | SOIC-8 | UDFN-8 | SOIC-8 | TSSOP-8 |
| Reach Compliance Code | unknown | compliant | compliant | compliant |
| Maximum clock frequency (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 |
| length | 4.925 mm | 3 mm | 4.925 mm | 4.4 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | HVSON | SOP | TSSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL |
| Maximum seat height | 1.75 mm | 0.6 mm | 1.75 mm | 1.2 mm |
| Serial bus type | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | NO LEAD | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 0.5 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| width | 3.9 mm | 2 mm | 3.9 mm | 3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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