R1QKA7236ABB-25IA datasheet, PDF

R1QKA7236ABB-25IA: DescriptionQDR SRAM; Categorystorage storage; File Size874KB，39 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R1QKA7236ABB-25IA Overview

QDR SRAM

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
package instruction	LBGA,
Reach Compliance Code	compliant
Maximum access time	0.55 ns
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	75497472 bit
Memory IC Type	QDR SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm
Base Number Matches	1

	R1QKA7236ABB-25IA	R1QKA7236ABB-25IS	R1QKA7236ABB-25IB
Description	QDR SRAM	QDR SRAM	QDR SRAM
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	LBGA,	LBGA,	LBGA,
Reach Compliance Code	compliant	compliant	compliant
Maximum access time	0.55 ns	0.55 ns	0.55 ns
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
length	15 mm	15 mm	15 mm
memory density	75497472 bit	75497472 bit	75497472 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM
memory width	36	36	36
Number of functions	1	1	1
Number of terminals	165	165	165
word count	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	2MX36	2MX36	2MX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	13 mm
Base Number Matches	1	1	1

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