IC,ANALOG MUX,SINGLE,8-CHANNEL,MOS,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum on-state resistance (Ron) | 400 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5,-20 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| Maximum signal current | 0.03 A |
| Maximum supply current (Isup) | 5.6 mA |
| surface mount | YES |
| switch | BREAK-BEFORE-MAKE |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| AM3705F/883C | AM3705F | AM3705F/883B | |
|---|---|---|---|
| Description | IC,ANALOG MUX,SINGLE,8-CHANNEL,MOS,FP,16PIN,CERAMIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,MOS,FP,16PIN,CERAMIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,MOS,FP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | compliant | compliant | compliant |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-XDFP-F16 | R-XDFP-F16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 |
| Number of channels | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 |
| Maximum on-state resistance (Ron) | 400 Ω | 400 Ω | 400 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | DFP |
| Encapsulate equivalent code | FL16,.3 | FL16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK |
| power supply | 5,-20 V | 5,-20 V | 5,-20 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum signal current | 0.03 A | 0.03 A | 0.03 A |
| Maximum supply current (Isup) | 5.6 mA | 5.6 mA | 5.6 mA |
| surface mount | YES | YES | YES |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | MOS | MOS | MOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| Filter level | MIL-STD-883 Class C | - | 38535Q/M;38534H;883B |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD