Microprocessor, 32-Bit, 133MHz, CMOS, PQFP208
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| bit size | 32 |
| JESD-30 code | S-PQFP-G208 |
| JESD-609 code | e0 |
| Humidity sensitivity level | 3 |
| Number of terminals | 208 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP208,1.2SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 2.5,3.3 V |
| Certification status | Not Qualified |
| speed | 133 MHz |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
| IDT79RC32T332-133DH | IDT79RC32V332-133DHI | IDT79RC32V332-100DHI | |
|---|---|---|---|
| Description | Microprocessor, 32-Bit, 133MHz, CMOS, PQFP208 | RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| bit size | 32 | 32 | 32 |
| JESD-30 code | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609 code | e0 | e0 | e0 |
| Humidity sensitivity level | 3 | 3 | 3 |
| Number of terminals | 208 | 208 | 208 |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | FQFP | FQFP |
| Encapsulate equivalent code | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 225 | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2.5,3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| speed | 133 MHz | 133 MHz | 100 MHz |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Base Number Matches | 1 | 1 | 1 |
| Parts packaging code | - | QFP | QFP |
| package instruction | - | 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 |
| Contacts | - | 208 | 208 |
| ECCN code | - | 3A001.A.3 | 3A001.A.3 |
| Has ADC | - | NO | NO |
| Address bus width | - | 32 | 32 |
| maximum clock frequency | - | 66.66 MHz | 50 MHz |
| DAC channel | - | NO | NO |
| DMA channel | - | YES | YES |
| External data bus width | - | 32 | 32 |
| length | - | 28 mm | 28 mm |
| Number of I/O lines | - | 8 | 8 |
| PWM channel | - | NO | NO |
| Maximum seat height | - | 4.1 mm | 4.1 mm |
| Maximum slew rate | - | 630 mA | 480 mA |
| Maximum supply voltage | - | 3.465 V | 3.465 V |
| Minimum supply voltage | - | 3.135 V | 3.135 V |
| Nominal supply voltage | - | 3.3 V | 3.3 V |
| width | - | 28 mm | 28 mm |
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