ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, BGA-165
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA |
| package instruction | TBGA, |
| Contacts | 165 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 6.5 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 code | R-PBGA-B165 |
| JESD-609 code | e0 |
| length | 15 mm |
| memory density | 18874368 bit |
| Memory IC Type | ZBT SRAM |
| memory width | 36 |
| Number of functions | 1 |
| Number of terminals | 165 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512KX36 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.465 V |
| Minimum supply voltage (Vsup) | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13 mm |
| Base Number Matches | 1 |
| AS7C33512NTD36A-250BI | AS7C33512NTD36A-250TQI | |
|---|---|---|
| Description | ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, BGA-165 | ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA | QFP |
| package instruction | TBGA, | LQFP, |
| Contacts | 165 | 100 |
| Reach Compliance Code | compliant | compliant |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 6.5 ns | 6.5 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 code | R-PBGA-B165 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 |
| length | 15 mm | 20 mm |
| memory density | 18874368 bit | 18874368 bit |
| Memory IC Type | ZBT SRAM | ZBT SRAM |
| memory width | 36 | 36 |
| Number of functions | 1 | 1 |
| Number of terminals | 165 | 100 |
| word count | 524288 words | 524288 words |
| character code | 512000 | 512000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| organize | 512KX36 | 512KX36 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TBGA | LQFP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.465 V | 3.465 V |
| Minimum supply voltage (Vsup) | 3.135 V | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | BALL | GULL WING |
| Terminal pitch | 1 mm | 0.65 mm |
| Terminal location | BOTTOM | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 13 mm | 14 mm |
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