LTC4301LIMS8 datasheet, PDF - EEWORLD Datasheet

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LTC4301LIMS8: DescriptionHot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size225KB，12 Pages; ManufacturerLinear ( ADI ); Websitehttp://www.analog.com/cn/index.html

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LTC4301LIMS8 Overview

Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation

LTC4301LIMS8 Parametric

Parameter Name	Attribute value
Brand Name	Linear Technology
Is it Rohs certified?	incompatible
entfamilyid	1384370
Maker	Linear ( ADI )
Objectid	2011083356
Parts packaging code	MSOP
package instruction	TSSOP, TSSOP8,.19
Contacts	8
Manufacturer packaging code	MS8
Reach Compliance Code	_compli
ECCN code	EAR99
compound_id	1417279
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G8
JESD-609 code	e0
length	3 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.19
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	235
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum slew rate	6.2 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	3 mm

LTC4301LIMS8 Related Products

	LTC4301LIMS8	LTC4301	LTC4301LCDD8	LTC4301LIDD8
Description	Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation	Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation	Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation	Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation
Is it Rohs certified?	incompatible	-	incompatible	incompatible
Maker	Linear ( ADI )	-	Linear ( ADI )	Linear ( ADI )
Parts packaging code	MSOP	-	SON	SON
package instruction	TSSOP, TSSOP8,.19	-	HVSON, SOLCC8,.11,20	HVSON, SOLCC8,.11,20
Contacts	8	-	8	8
Reach Compliance Code	_compli	-	compli	compli
ECCN code	EAR99	-	EAR99	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT	-	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G8	-	S-XDSO-N8	S-XDSO-N8
JESD-609 code	e0	-	e0	e0
length	3 mm	-	3 mm	3 mm
Humidity sensitivity level	1	-	1	1
Number of functions	1	-	1	1
Number of terminals	8	-	8	8
Maximum operating temperature	85 °C	-	70 °C	85 °C
Package body material	PLASTIC/EPOXY	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	TSSOP	-	HVSON	HVSON
Encapsulate equivalent code	TSSOP8,.19	-	SOLCC8,.11,20	SOLCC8,.11,20
Package shape	SQUARE	-	SQUARE	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	235	-	255	255
power supply	3/5 V	-	3/5 V	3/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	-	0.8 mm	0.8 mm
Maximum slew rate	6.2 mA	-	6.2 mA	6.2 mA
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage	2.7 V	-	2.7 V	2.7 V
Nominal supply voltage	3.3 V	-	3.3 V	3.3 V
surface mount	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	NO LEAD	NO LEAD
Terminal pitch	0.65 mm	-	0.5 mm	0.5 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	20	-	40	40
width	3 mm	-	3 mm	3 mm

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