Video Switch ICs
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Parts packaging code | QFN |
package instruction | 5 X 5 MM, 0.80 MM HEIGHT, MO-220WHHD-2, TQFN-32 |
Contacts | 32 |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
Analog Integrated Circuits - Other Types | VIDEO MULTIPLEXER |
JESD-30 code | S-XQCC-N32 |
JESD-609 code | e0 |
length | 5 mm |
Humidity sensitivity level | 1 |
Number of channels | 2 |
Number of functions | 1 |
Number of terminals | 32 |
Nominal off-state isolation | 40 dB |
On-state resistance matching specifications | 0.5 Ω |
Maximum on-state resistance (Ron) | 7.5 Ω |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Encapsulate equivalent code | LCC32,.2SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 2.5/5,5 V |
Certification status | Not Qualified |
Maximum seat height | 0.8 mm |
Maximum supply current (Isup) | 0.5 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
Maximum connection time | 7000 ns |
switch | BREAK-BEFORE-MAKE |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 5 mm |
Base Number Matches | 1 |
MAX4885ETJ-T | MAX4885ETJ | |
---|---|---|
Description | Video Switch ICs | Video Switch ICs |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Maker | Maxim | Maxim |
Reach Compliance Code | not_compliant | not_compliant |
Is Samacsys | N | N |
Analog Integrated Circuits - Other Types | VIDEO MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | S-XQCC-N32 | S-PQCC-N32 |
JESD-609 code | e0 | e0 |
Humidity sensitivity level | 1 | 1 |
Number of channels | 2 | 2 |
Number of functions | 1 | 2 |
Number of terminals | 32 | 32 |
Maximum on-state resistance (Ron) | 7.5 Ω | 20 Ω |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Package body material | UNSPECIFIED | PLASTIC/EPOXY |
encapsulated code | HVQCCN | QCCN |
Encapsulate equivalent code | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
Package shape | SQUARE | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 245 | 225 |
power supply | 2.5/5,5 V | 2.5/5,5 V |
Certification status | Not Qualified | Not Qualified |
Maximum supply current (Isup) | 0.5 mA | 0.5 mA |
surface mount | YES | YES |
Maximum connection time | 7000 ns | 7000 ns |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | BICMOS | BICMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | NO LEAD |
Terminal pitch | 0.5 mm | 0.5 mm |
Terminal location | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 |