Part Number |
W77E058A40DL |
W77E058A40FL |
W77E058A40PL |
Description |
IC mcu 8-bit 32k flash 40-dip |
IC mcu 8-bit 32k flash 44-pqfp |
IC mcu 8-bit 32k flash 44-plcc |
Is it lead-free? |
Lead free |
Contains lead |
Contains lead |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
Maker |
Nuvoton Technology Corporation |
Nuvoton Technology Corporation |
Nuvoton Technology Corporation |
Parts packaging code |
DIP |
QFP |
LCC |
package instruction |
DIP, DIP40,.6 |
QFP-44 |
LCC-44 |
Contacts |
40 |
44 |
44 |
Reach Compliance Code |
compli |
compli |
compli |
ECCN code |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
Has ADC |
NO |
NO |
NO |
Address bus width |
16 |
16 |
16 |
bit size |
8 |
8 |
8 |
CPU series |
8051 |
8051 |
8051 |
maximum clock frequency |
40 MHz |
40 MHz |
40 MHz |
DAC channel |
NO |
NO |
NO |
DMA channel |
NO |
NO |
NO |
External data bus width |
8 |
8 |
8 |
JESD-30 code |
R-PDIP-T40 |
S-PQFP-G44 |
S-PQCC-J44 |
JESD-609 code |
e3 |
e0 |
e0 |
length |
52.2 mm |
10 mm |
16.59 mm |
Number of I/O lines |
32 |
36 |
36 |
Number of terminals |
40 |
44 |
44 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
PWM channel |
NO |
NO |
NO |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
QFP |
QCCJ |
Encapsulate equivalent code |
DIP40,.6 |
QFP44,.5SQ,32 |
LDCC44,.7SQ |
Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
Package form |
IN-LINE |
FLATPACK |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
245 |
NOT SPECIFIED |
225 |
power supply |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (bytes) |
1024 |
1024 |
1024 |
rom(word) |
32678 |
32678 |
32678 |
ROM programmability |
FLASH |
FLASH |
FLASH |
Maximum seat height |
5.334 mm |
2.7 mm |
4.699 mm |
speed |
40 MHz |
40 MHz |
40 MHz |
Maximum slew rate |
50 mA |
50 mA |
50 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage |
5 V |
5 V |
5 V |
surface mount |
NO |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
TIN LEAD |
Terminal form |
THROUGH-HOLE |
GULL WING |
J BEND |
Terminal pitch |
2.54 mm |
0.8 mm |
1.27 mm |
Terminal location |
DUAL |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
width |
15.24 mm |
10 mm |
16.59 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |