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h5tc2g43bfr

Showing 4 Results for h5tc2g43bfr, including H5TC2G43BFR,H5TC2G43BFR-G7A, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
H5TC2G43BFR SK Hynix 2Gb DDR3L SDRAM Download
H5TC2G43BFR-G7A SK Hynix DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82 Download
H5TC2G43BFR-H9A SK Hynix DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82 Download
H5TC2G43BFR-PBA SK Hynix DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82 Download
h5tc2g43bfr Related Product Datasheets:
Part Number Datasheet
H5TC2G43BFR-G7A 、 H5TC2G43BFR-H9A 、 H5TC2G43BFR-PBA Download Datasheet
H5TC2G43BFR Download Datasheet
h5tc2g43bfr Related Products:
Part Number H5TC2G43BFR-PBA H5TC2G43BFR-G7A H5TC2G43BFR-H9A
Description DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82 DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82 DDR DRAM, 512MX4, CMOS, PBGA82, HALOGEN FREE AND ROHS COMPLIANT, FBGA-82
Is it Rohs certified? conform to conform to conform to
Parts packaging code BGA BGA BGA
package instruction TFBGA, BGA82,11X13,32 TFBGA, BGA82,11X13,32 TFBGA, BGA82,11X13,32
Contacts 82 82 82
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 800 MHz 533 MHz 667 MHz
I/O type COMMON COMMON COMMON
interleaved burst length 4,8 4,8 4,8
JESD-30 code S-PBGA-B82 S-PBGA-B82 S-PBGA-B82
JESD-609 code e1 e1 e1
length 11 mm 11 mm 11 mm
memory density 2147483648 bit 2147483648 bit 2147483648 bit
Memory IC Type DDR DRAM DDR DRAM DDR DRAM
memory width 4 4 4
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 82 82 82
word count 536870912 words 536870912 words 536870912 words
character code 512000000 512000000 512000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C
organize 512MX4 512MX4 512MX4
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA82,11X13,32 BGA82,11X13,32 BGA82,11X13,32
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260
power supply 1.35 V 1.35 V 1.35 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192
Maximum seat height 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES
Continuous burst length 4,8 4,8 4,8
Maximum standby current 0.01 A 0.01 A 0.01 A
Maximum slew rate 0.165 mA 0.16 mA 0.16 mA
Maximum supply voltage (Vsup) 1.45 V 1.45 V 1.45 V
Minimum supply voltage (Vsup) 1.283 V 1.283 V 1.283 V
Nominal supply voltage (Vsup) 1.35 V 1.35 V 1.35 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20
width 9.4 mm 9.4 mm 9.4 mm
Maker - SK Hynix SK Hynix

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