Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | XILINX(赛灵思) |
Parts packaging code | BGA |
package instruction | FBGA-668 |
Contacts | 668 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.D |
Factory Lead Time | 12 weeks |
maximum clock frequency | 1205 MHz |
JESD-30 code | S-PBGA-B668 |
JESD-609 code | e0 |
length | 27 mm |
Humidity sensitivity level | 4 |
Configurable number of logic blocks | 4608 |
Number of entries | 448 |
Number of logical units | 41472 |
Output times | 448 |
Number of terminals | 668 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 4608 CLBS |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA668,26X26,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.85 mm |
Maximum supply voltage | 1.26 V |
Minimum supply voltage | 1.14 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 27 mm |