Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
WEDPN16M72VR-125B2M | White Electronic Designs Corporation | 16M X 72 SYNCHRONOUS DRAM MODULE, 5.8 ns, PBGA219 | Download |
WEDPN16M72VR-125B2M | Microsemi | Synchronous DRAM Module, 16MX72, 5.8ns, CMOS, PBGA219, 25 X 25 MM, PLASTIC, BGA-219 | Download |
Synchronous DRAM Module, 16MX72, 5.8ns, CMOS, PBGA219, 25 X 25 MM, PLASTIC, BGA-219
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Parts packaging code | BGA |
package instruction | 25 X 25 MM, PLASTIC, BGA-219 |
Contacts | 219 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 5.8 ns |
Other features | AUTO REFRESH |
JESD-30 code | S-PBGA-B219 |
memory density | 1207959552 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 219 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 16MX72 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | BALL |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |