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W3H64M72E-400SBI

Showing 4 Results for W3H64M72E-400SBI, including W3H64M72E-400SBI,W3H64M72E-400SBI, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W3H64M72E-400SBI White Electronic Designs Corporation 64M X 72 DDR DRAM, PBGA208 Download
W3H64M72E-400SBI Microsemi DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 Download
W3H64M72E-400SBIF White Electronic Designs Corporation DDR DRAM, 64MX72, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Download
W3H64M72E-400SBIF Microsemi DDR DRAM, 64MX72, 0.8ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Download
W3H64M72E-400SBI Related Product Datasheets:
Part Number Datasheet
W3H64M72E-400SBI 、 W3H64M72E-400SBIF Download Datasheet
W3H64M72E-400SBIF Download Datasheet
W3H64M72E-400SBI Download Datasheet
W3H64M72E-400SBI Related Products:
Part Number W3H64M72E-400SBIF W3H64M72E-400SBI
Description DDR DRAM, 64MX72, 0.8ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Is it Rohs certified? conform to incompatible
Maker Microsemi Microsemi
Parts packaging code BGA BGA
package instruction BGA, BGA208,11X19,40 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Contacts 208 208
Reach Compliance Code compliant unknown
ECCN code EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Maximum access time 0.8 ns 0.6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 200 MHz 200 MHz
I/O type COMMON COMMON
JESD-30 code R-PBGA-B208 R-PBGA-B208
memory density 4831838208 bit 4831838208 bit
Memory IC Type DDR DRAM DDR DRAM
memory width 72 72
Number of functions 1 1
Number of ports 1 1
Number of terminals 208 208
word count 67108864 words 67108864 words
character code 64000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 64MX72 64MX72
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA208,11X19,40 BGA208,11X19,40
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
power supply 1.8 V 1.8 V
Certification status Not Qualified Not Qualified
refresh cycle 8192 8192
self refresh YES YES
Maximum slew rate 1.42 mA 1.65 mA
Maximum supply voltage (Vsup) 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM

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