Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
W3H64M72E-400SBI | White Electronic Designs Corporation | 64M X 72 DDR DRAM, PBGA208 | Download |
W3H64M72E-400SBI | Microsemi | DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 | Download |
W3H64M72E-400SBIF | White Electronic Designs Corporation | DDR DRAM, 64MX72, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 | Download |
W3H64M72E-400SBIF | Microsemi | DDR DRAM, 64MX72, 0.8ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 | Download |
Part Number | Datasheet |
---|---|
W3H64M72E-400SBI 、 W3H64M72E-400SBIF | Download Datasheet |
W3H64M72E-400SBIF | Download Datasheet |
W3H64M72E-400SBI | Download Datasheet |
Part Number | W3H64M72E-400SBIF | W3H64M72E-400SBI |
---|---|---|
Description | DDR DRAM, 64MX72, 0.8ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 | DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 |
Is it Rohs certified? | conform to | incompatible |
Maker | Microsemi | Microsemi |
Parts packaging code | BGA | BGA |
package instruction | BGA, BGA208,11X19,40 | 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 |
Contacts | 208 | 208 |
Reach Compliance Code | compliant | unknown |
ECCN code | EAR99 | EAR99 |
access mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
Maximum access time | 0.8 ns | 0.6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 200 MHz | 200 MHz |
I/O type | COMMON | COMMON |
JESD-30 code | R-PBGA-B208 | R-PBGA-B208 |
memory density | 4831838208 bit | 4831838208 bit |
Memory IC Type | DDR DRAM | DDR DRAM |
memory width | 72 | 72 |
Number of functions | 1 | 1 |
Number of ports | 1 | 1 |
Number of terminals | 208 | 208 |
word count | 67108864 words | 67108864 words |
character code | 64000000 | 64000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
organize | 64MX72 | 64MX72 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA |
Encapsulate equivalent code | BGA208,11X19,40 | BGA208,11X19,40 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY |
power supply | 1.8 V | 1.8 V |
Certification status | Not Qualified | Not Qualified |
refresh cycle | 8192 | 8192 |
self refresh | YES | YES |
Maximum slew rate | 1.42 mA | 1.65 mA |
Maximum supply voltage (Vsup) | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL |
Terminal pitch | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM |