Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Winbond(华邦电子) |
Parts packaging code | SON |
package instruction | HVSON, SOLCC8,.11,20 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Other features | IT ALSO OPERATES AT 2.3 V AT 80 MHZ |
Maximum clock frequency (fCLK) | 104 MHz |
Data retention time - minimum | 20 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-N8 |
length | 3 mm |
memory density | 4194304 bi |
Memory IC Type | FLASH |
memory width | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 4MX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVSON |
Encapsulate equivalent code | SOLCC8,.11,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2.5/3.3 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
Maximum seat height | 0.6 mm |
Serial bus type | SPI |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.015 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 2 mm |
write protect | HARDWARE/SOFTWARE |