Part Number |
W25X40BVZPIG |
W25X40BV |
W25X40BVDAIG |
W25X40BVSNIG |
W25X40BVSSIG |
Description |
2M X 1 FLASH 2.7V PROM, PDSO8 |
2M X 1 FLASH 2.7V PROM, PDSO8 |
2M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
memory width |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 Cel |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
organize |
4MX1 |
2M × 1 |
4MX1 |
4MX1 |
4MX1 |
surface mount |
YES |
Yes |
NO |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
Terminal location |
DUAL |
pair |
DUAL |
DUAL |
DUAL |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
conform to |
Maker |
Winbond Electronics Corporation |
- |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Parts packaging code |
SON |
- |
DIP |
SOIC |
SOIC |
package instruction |
WSON-8 |
- |
DIP-8 |
SOP, SOP8,.25 |
SOIC-8 |
Contacts |
8 |
- |
8 |
8 |
8 |
Reach Compliance Code |
unknown |
- |
compli |
unknow |
unknow |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
80 MHz |
- |
80 MHz |
80 MHz |
80 MHz |
Data retention time - minimum |
20 |
- |
20 |
20 |
20 |
Durability |
100000 Write/Erase Cycles |
- |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-N8 |
- |
R-PDIP-T8 |
R-PDSO-G8 |
S-PDSO-G8 |
length |
6 mm |
- |
9.27 mm |
4.85 mm |
5.28 mm |
memory density |
4194304 bit |
- |
4194304 bi |
4194304 bi |
4194304 bi |
Memory IC Type |
FLASH |
- |
FLASH |
FLASH |
FLASH |
word count |
4194304 words |
- |
4194304 words |
4194304 words |
4194304 words |
character code |
4000000 |
- |
4000000 |
4000000 |
4000000 |
Operating mode |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
- |
DIP |
SOP |
SOP |
Encapsulate equivalent code |
SOLCC8,.25 |
- |
DIP8,.3 |
SOP8,.25 |
SOP8,.3 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
SERIAL |
- |
SERIAL |
SERIAL |
SERIAL |
power supply |
3/3.3 V |
- |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Programming voltage |
2.7 V |
- |
2.7 V |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.8 mm |
- |
5.33 mm |
1.72 mm |
2.16 mm |
Serial bus type |
SPI |
- |
SPI |
SPI |
SPI |
Maximum standby current |
0.000005 A |
- |
0.000005 A |
0.000005 A |
0.000005 A |
Maximum slew rate |
0.025 mA |
- |
0.025 mA |
0.025 mA |
0.025 mA |
Maximum supply voltage (Vsup) |
3.6 V |
- |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
- |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
- |
3 V |
3 V |
3 V |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Terminal pitch |
1.27 mm |
- |
2.54 mm |
1.27 mm |
1.27 mm |
type |
NOR TYPE |
- |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
5 mm |
- |
7.62 mm |
3.9 mm |
5.28 mm |
write protect |
HARDWARE/SOFTWARE |
- |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |