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W25X40BV

Showing 5 Results for W25X40BV, including W25X40BV,W25X40BVDAIG, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W25X40BV Winbond Electronics Corporation 2M X 1 FLASH 2.7V PROM, PDSO8 Download
W25X40BVDAIG Winbond Electronics Corporation 2M X 1 FLASH 2.7V PROM, PDSO8 Download
W25X40BVSNIG Winbond Electronics Corporation 4M X 1 FLASH 2.7V PROM, PDSO8 Download
W25X40BVSSIG Winbond Electronics Corporation 4M X 1 FLASH 2.7V PROM, PDSO8 Download
W25X40BVZPIG Winbond Electronics Corporation 2M X 1 FLASH 2.7V PROM, PDSO8 Download
W25X40BV Related Product Datasheets:
Part Number Datasheet
W25X40BV 、 W25X40BVDAIG 、 W25X40BVSNIG 、 W25X40BVSSIG 、 W25X40BVZPIG Download Datasheet
W25X40BV Related Products:
Part Number W25X40BVZPIG W25X40BV W25X40BVDAIG W25X40BVSNIG W25X40BVSSIG
Description 2M X 1 FLASH 2.7V PROM, PDSO8 2M X 1 FLASH 2.7V PROM, PDSO8 2M X 1 FLASH 2.7V PROM, PDSO8 4M X 1 FLASH 2.7V PROM, PDSO8 4M X 1 FLASH 2.7V PROM, PDSO8
memory width 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 Cel -40 °C -40 °C -40 °C
organize 4MX1 2M × 1 4MX1 4MX1 4MX1
surface mount YES Yes NO YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal location DUAL pair DUAL DUAL DUAL
Is it Rohs certified? conform to - conform to conform to conform to
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code SON - DIP SOIC SOIC
package instruction WSON-8 - DIP-8 SOP, SOP8,.25 SOIC-8
Contacts 8 - 8 8 8
Reach Compliance Code unknown - compli unknow unknow
ECCN code EAR99 - EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 80 MHz - 80 MHz 80 MHz 80 MHz
Data retention time - minimum 20 - 20 20 20
Durability 100000 Write/Erase Cycles - 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDSO-N8 - R-PDIP-T8 R-PDSO-G8 S-PDSO-G8
length 6 mm - 9.27 mm 4.85 mm 5.28 mm
memory density 4194304 bit - 4194304 bi 4194304 bi 4194304 bi
Memory IC Type FLASH - FLASH FLASH FLASH
word count 4194304 words - 4194304 words 4194304 words 4194304 words
character code 4000000 - 4000000 4000000 4000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON - DIP SOP SOP
Encapsulate equivalent code SOLCC8,.25 - DIP8,.3 SOP8,.25 SOP8,.3
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - IN-LINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL - SERIAL SERIAL SERIAL
power supply 3/3.3 V - 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V - 2.7 V 2.7 V 2.7 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 0.8 mm - 5.33 mm 1.72 mm 2.16 mm
Serial bus type SPI - SPI SPI SPI
Maximum standby current 0.000005 A - 0.000005 A 0.000005 A 0.000005 A
Maximum slew rate 0.025 mA - 0.025 mA 0.025 mA 0.025 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V - 3 V 3 V 3 V
technology CMOS - CMOS CMOS CMOS
Terminal pitch 1.27 mm - 2.54 mm 1.27 mm 1.27 mm
type NOR TYPE - NOR TYPE NOR TYPE NOR TYPE
width 5 mm - 7.62 mm 3.9 mm 5.28 mm
write protect HARDWARE/SOFTWARE - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE

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