Part Number |
STP16NS25FP |
STP16NS25 |
Description |
MOSFET N-Ch 250 Volt 16 Amp |
MOSFET N-Ch 250 Volt 16 Amp |
Is it Rohs certified? |
conform to |
conform to |
Maker |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
TO-220AB |
TO-220AB |
package instruction |
TO-220FP, 3 PIN |
TO-220, 3 PIN |
Contacts |
3 |
3 |
Reach Compliance Code |
not_compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
600 mJ |
600 mJ |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
250 V |
250 V |
Maximum drain current (Abs) (ID) |
16 A |
16 A |
Maximum drain current (ID) |
16 A |
16 A |
Maximum drain-source on-resistance |
0.28 Ω |
0.28 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code |
TO-220AB |
TO-220AB |
JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
JESD-609 code |
e3 |
e3 |
Number of components |
1 |
1 |
Number of terminals |
3 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
FLANGE MOUNT |
FLANGE MOUNT |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Maximum power dissipation(Abs) |
40 W |
140 W |
Maximum pulsed drain current (IDM) |
64 A |
64 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
NO |
NO |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal location |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |