Part Number |
SN74LVC1G11DBVRG4 |
SN74LVC1G11DBVRE4 |
Description |
Single 3-Input Positive-AND Gate 6-SOT-23 -40 to 125 |
Single 3-Input Positive-AND Gate 6-SOT-23 -40 to 125 |
Brand Name |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOT-23 |
SOT-23 |
package instruction |
LSSOP, TSOP6,.11,37 |
LSSOP, TSOP6,.11,37 |
Contacts |
6 |
6 |
Reach Compliance Code |
compli |
compli |
Factory Lead Time |
6 weeks |
6 weeks |
Samacsys Descripti |
Logic Gates SNGL 3 Input Pos AND Gate |
Logic Gates SNGL 3 Input Pos AND Gate |
series |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G6 |
R-PDSO-G6 |
JESD-609 code |
e4 |
e4 |
length |
2.9 mm |
2.9 mm |
Load capacitance (CL) |
50 pF |
50 pF |
Logic integrated circuit type |
AND GATE |
AND GATE |
MaximumI(ol) |
0.032 A |
0.032 A |
Humidity sensitivity level |
1 |
1 |
Number of functions |
1 |
1 |
Number of entries |
3 |
3 |
Number of terminals |
6 |
6 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LSSOP |
LSSOP |
Encapsulate equivalent code |
TSOP6,.11,37 |
TSOP6,.11,37 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
method of packing |
TR |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
3.3 V |
3.3 V |
Maximum supply current (ICC) |
0.01 mA |
0.01 mA |
Prop。Delay @ Nom-Su |
4.9 ns |
4.9 ns |
propagation delay (tpd) |
17.2 ns |
17.2 ns |
Certification status |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
Maximum seat height |
1.45 mm |
1.45 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.95 mm |
0.95 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
1.6 mm |
1.6 mm |