Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
MC9S12XDT256VAA | FREESCALE (NXP) | 16-bit microcontrollers - mcu 9s12xdt256 tsmc3 general | Download |
MC9S12XDT256VAA | Rochester Electronics | 16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQFP80, LEAD FREE, PLASTIC, QFP-80 | Download |
MC9S12XDT256VAA | NXP | 16-bit Microcontrollers - MCU 9S12XDT256 TSMC3 GENERAL | Download |
MC9S12XDT256VAAR | NXP | 16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQFP80, LEAD FREE, PLASTIC, QFP-80 | Download |
16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQFP80, LEAD FREE, PLASTIC, QFP-80
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Parts packaging code | QFP |
package instruction | LEAD FREE, PLASTIC, QFP-80 |
Contacts | 80 |
Reach Compliance Code | unknown |
Has ADC | YES |
Address bus width | |
bit size | 16 |
maximum clock frequency | 80 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | |
JESD-30 code | S-PQFP-G80 |
JESD-609 code | e3 |
length | 14 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 59 |
Number of terminals | 80 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 260 |
ROM programmability | FLASH |
Maximum seat height | 2.45 mm |
speed | 40 MHz |
Maximum supply voltage | 2.75 V |
Minimum supply voltage | 2.35 V |
Nominal supply voltage | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 14 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
Base Number Matches | 1 |