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MC68MH360ZQ33L

Among 4 related components, MC68MH360ZQ33L have related pdf.
Part Number Manufacturer Description Datasheet
MC68MH360ZQ33L FREESCALE (NXP) microprocessors - mpu quicc 2smc 1spi Download
MC68MH360ZQ33L NXP Programmers - Processor Based Universal Multilink In-Cir Debug/Program Download
MC68MH360ZQ33LR2 FREESCALE (NXP) IC mpu quicc 33mhz 357-pbga Download
MC68MH360ZQ33LR2 NXP Microprocessors - MPU QUICC 2SMC 1SPI Download
MC68MH360ZQ33L parameters:

Description

Programmers - Processor Based Universal Multilink In-Cir Debug/Program

Parametric
Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP(NXP)
package instruction1.27 MM PITCH, PLASTIC, BGA-357
Reach Compliance Codeunknown
ECCN code3A991
Address bus width32
boundary scanYES
Bus compatibilityMC68040; MC68030
maximum clock frequency25 MHz
letter of agreementBISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
Data encoding/decoding methodsNRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
Maximum data transfer rate1.25 MBps
External data bus width32
JESD-30 codeS-PBGA-B357
JESD-609 codee0
length25 mm
low power modeYES
Humidity sensitivity level3
Number of terminals357
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
Maximum seat height1.86 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width25 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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