Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP(NXP) |
package instruction | 1.27 MM PITCH, PLASTIC, BGA-357 |
Reach Compliance Code | unknown |
ECCN code | 3A991 |
Address bus width | 32 |
boundary scan | YES |
Bus compatibility | MC68040; MC68030 |
maximum clock frequency | 25 MHz |
letter of agreement | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
Data encoding/decoding methods | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
Maximum data transfer rate | 1.25 MBps |
External data bus width | 32 |
JESD-30 code | S-PBGA-B357 |
JESD-609 code | e0 |
length | 25 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 357 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
Maximum seat height | 1.86 mm |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 25 mm |
uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |