Part Number |
MAX5074AUP+T |
MAX5074AUP+ |
Description |
IC pwr for ieee 802.3af 20tssop |
IC pwr for ieee 802.3af 20tssop |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Maxim |
Maxim |
Parts packaging code |
TSSOP |
TSSOP |
package instruction |
HTSSOP, |
HTSSOP, |
Contacts |
20 |
20 |
Reach Compliance Code |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
Analog Integrated Circuits - Other Types |
SWITCHING REGULATOR |
SWITCHING REGULATOR |
control mode |
VOLTAGE-MODE |
VOLTAGE-MODE |
Control Technology |
PULSE WIDTH MODULATION |
PULSE WIDTH MODULATION |
Maximum input voltage |
76 V |
76 V |
Minimum input voltage |
11 V |
11 V |
Nominal input voltage |
12 V |
12 V |
JESD-30 code |
R-PDSO-G20 |
R-PDSO-G20 |
JESD-609 code |
e3 |
e3 |
length |
6.5 mm |
6.5 mm |
Humidity sensitivity level |
1 |
1 |
Number of functions |
1 |
1 |
Number of terminals |
20 |
20 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HTSSOP |
HTSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1.1 mm |
surface mount |
YES |
YES |
Switch configuration |
SINGLE |
SINGLE |
Maximum switching frequency |
500 kHz |
500 kHz |
technology |
BICMOS |
BICMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
4.4 mm |