Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim(美信半导体) |
Parts packaging code | DIP |
package instruction | CERDIP-8 |
Contacts | 8 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-GDIP-T8 |
JESD-609 code | e0 |
Humidity sensitivity level | 1 |
Maximum negative supply voltage (Vsup) | -18 V |
Negative supply voltage minimum (Vsup) | -8 V |
Nominal Negative Supply Voltage (Vsup) | -15 V |
Number of channels | 1 |
Number of functions | 3 |
Number of terminals | 8 |
On-state resistance matching specifications | 1 Ω |
Maximum on-state resistance (Ron) | 100 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 240 |
power supply | +-15 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 18 V |
Minimum supply voltage (Vsup) | 8 V |
Nominal supply voltage (Vsup) | 15 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 20 |
width | 7.62 mm |