Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Integrated Silicon Solution ( ISSI ) |
package instruction | LFBGA, |
Reach Compliance Code | compliant |
Factory Lead Time | 12 weeks |
access mode | DUAL BANK PAGE BURST |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B96 |
JESD-609 code | e1 |
length | 14 mm |
memory density | 8589934592 bit |
Memory IC Type | DDR DRAM |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 96 |
word count | 536870912 words |
character code | 512000000 |
Operating mode | SYNCHRONOUS |
organize | 512MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
Maximum seat height | 1.4 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.575 V |
Minimum supply voltage (Vsup) | 1.425 V |
Nominal supply voltage (Vsup) | 1.5 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 10 |
width | 10 mm |