Part Number |
IS43DR16320E-3DBL |
IS43DR16320E-3DBL |
IS43DR16320E-3DBLI |
IS43DR16320E-3DBLI |
Description |
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, BGA-84 |
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, BGA-84 |
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, BGA-84 |
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, BGA-84 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
ISSI(Integrated Silicon Solution Inc.) |
Integrated Silicon Solution ( ISSI ) |
ISSI(Integrated Silicon Solution Inc.) |
Integrated Silicon Solution ( ISSI ) |
package instruction |
TFBGA, |
TFBGA, |
TFBGA, |
TFBGA, |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
Is Samacsys |
N |
N |
N |
N |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
0.45 ns |
0.45 ns |
0.45 ns |
0.45 ns |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
JESD-30 code |
R-PBGA-B84 |
R-PBGA-B84 |
R-PBGA-B84 |
R-PBGA-B84 |
length |
10.5 mm |
10.5 mm |
10.5 mm |
10.5 mm |
memory density |
536870912 bit |
536870912 bit |
536870912 bit |
536870912 bit |
Memory IC Type |
DDR DRAM |
DDR DRAM |
DDR DRAM |
DDR DRAM |
memory width |
16 |
16 |
16 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
Number of terminals |
84 |
84 |
84 |
84 |
word count |
33554432 words |
33554432 words |
33554432 words |
33554432 words |
character code |
32000000 |
32000000 |
32000000 |
32000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
organize |
32MX16 |
32MX16 |
32MX16 |
32MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TFBGA |
TFBGA |
TFBGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
self refresh |
YES |
YES |
YES |
YES |
Maximum supply voltage (Vsup) |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
Minimum supply voltage (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
OTHER |
OTHER |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8 mm |
8 mm |
8 mm |
8 mm |
Base Number Matches |
1 |
1 |
1 |
1 |