Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BGA |
package instruction | LBGA, BGA256,16X16,40 |
Contacts | 256 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 15 ns |
Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
memory density | 18874368 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 256 |
word count | 524288 words |
character code | 512000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 2.5,2.5/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.5 mm |
Maximum standby current | 0.025 A |
Minimum standby current | 2.4 V |
Maximum slew rate | 0.9 mA |
Maximum supply voltage (Vsup) | 2.6 V |
Minimum supply voltage (Vsup) | 2.4 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |
width | 17 mm |
Base Number Matches | 1 |