Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SK Hynix(海力士) |
Parts packaging code | DIMM |
package instruction | DIMM, DIMM240,40 |
Contacts | 240 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Maximum access time | 20 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 667 MHz |
I/O type | COMMON |
JESD-30 code | R-XDMA-N240 |
JESD-609 code | e1 |
length | 133.35 mm |
memory density | 38654705664 bi |
Memory IC Type | DDR DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 240 |
word count | 536870912 words |
character code | 512000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 512MX72 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM240,40 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.5 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
Maximum seat height | 3.46 mm |
self refresh | YES |
Maximum standby current | 0.588 A |
Maximum slew rate | 4.274 mA |
Maximum supply voltage (Vsup) | 1.575 V |
Minimum supply voltage (Vsup) | 1.425 V |
Nominal supply voltage (Vsup) | 1.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | NO LEAD |
Terminal pitch | 1 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 20 |
width | 30 mm |