Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
GS8662T19BD-300 | GSI Technology | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Download |
GS8662T19BD-300I | GSI Technology | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Download |
GS8662T19BD-300IT | GSI Technology | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | Download |
GS8662T19BD-300T | GSI Technology | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | Download |
Part Number | Datasheet |
---|---|
GS8662T19BD-300 、 GS8662T19BD-300I 、 GS8662T19BD-300IT 、 GS8662T19BD-300T | Download Datasheet |
Part Number | GS8662T19BD-300T | GS8662T19BD-300 | GS8662T19BD-300I | GS8662T19BD-300IT |
---|---|---|---|---|
Description | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | BGA | BGA | BGA | BGA |
package instruction | LBGA, | LBGA, | LBGA, | LBGA, |
Contacts | 165 | 165 | 165 | 165 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
Maximum access time | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns |
Other features | PIPELINED ARCHITECTURE, LATE WRITE | PIPELINED ARCHITECTURE, LATE WRITE | PIPELINED ARCHITECTURE, LATE WRITE | PIPELINED ARCHITECTURE, LATE WRITE |
JESD-30 code | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
length | 15 mm | 15 mm | 15 mm | 15 mm |
memory density | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bit |
Memory IC Type | DDR SRAM | DDR SRAM | DDR SRAM | DDR SRAM |
memory width | 18 | 18 | 18 | 18 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 165 | 165 | 165 | 165 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C |
organize | 4MX18 | 4MX18 | 4MX18 | 4MX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LBGA | LBGA | LBGA | LBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 13 mm | 13 mm | 13 mm | 13 mm |
Base Number Matches | 1 | 1 | 1 | 1 |