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GS8662T19BD-300

Showing 4 Results for GS8662T19BD-300, including GS8662T19BD-300,GS8662T19BD-300I, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
GS8662T19BD-300 GSI Technology DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 Download
GS8662T19BD-300I GSI Technology DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 Download
GS8662T19BD-300IT GSI Technology DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 Download
GS8662T19BD-300T GSI Technology DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 Download
GS8662T19BD-300 Related Product Datasheets:
Part Number Datasheet
GS8662T19BD-300 、 GS8662T19BD-300I 、 GS8662T19BD-300IT 、 GS8662T19BD-300T Download Datasheet
GS8662T19BD-300 Related Products:
Part Number GS8662T19BD-300T GS8662T19BD-300 GS8662T19BD-300I GS8662T19BD-300IT
Description DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Is it Rohs certified? incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA BGA BGA
package instruction LBGA, LBGA, LBGA, LBGA,
Contacts 165 165 165 165
Reach Compliance Code compliant compliant compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 0.45 ns 0.45 ns 0.45 ns 0.45 ns
Other features PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE, LATE WRITE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
length 15 mm 15 mm 15 mm 15 mm
memory density 75497472 bit 75497472 bit 75497472 bit 75497472 bit
Memory IC Type DDR SRAM DDR SRAM DDR SRAM DDR SRAM
memory width 18 18 18 18
Number of functions 1 1 1 1
Number of terminals 165 165 165 165
word count 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C
organize 4MX18 4MX18 4MX18 4MX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 13 mm 13 mm 13 mm 13 mm
Base Number Matches 1 1 1 1

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