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GS8182R09BGD-167

Showing 4 Results for GS8182R09BGD-167, including GS8182R09BGD-167,GS8182R09BGD-167I, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
GS8182R09BGD-167 GSI Technology SRAM 1.8 or 1.5V 2M x 9 18M Download
GS8182R09BGD-167I GSI Technology SRAM 1.8 or 1.5V 2M x 9 18M Download
GS8182R09BGD-167IT GSI Technology DDR SRAM, 2MX9, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8182R09BGD-167T GSI Technology DDR SRAM, 2MX9, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8182R09BGD-167 Related Product Datasheets:
Part Number Datasheet
GS8182R09BGD-167IT 、 GS8182R09BGD-167T Download Datasheet
GS8182R09BGD-167 、 GS8182R09BGD-167I Download Datasheet
GS8182R09BGD-167 Related Products:
Part Number GS8182R09BGD-167 GS8182R09BGD-167I
Description SRAM 1.8 or 1.5V 2M x 9 18M SRAM 1.8 or 1.5V 2M x 9 18M
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker GSI Technology GSI Technology
Parts packaging code BGA BGA
package instruction LBGA, LBGA,
Contacts 165 165
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B
Factory Lead Time 8 weeks 8 weeks
Maximum access time 0.5 ns 0.5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PBGA-B165 R-PBGA-B165
JESD-609 code e1 e1
length 15 mm 15 mm
memory density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM DDR SRAM
memory width 9 9
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 165 165
word count 2097152 words 2097152 words
character code 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C
organize 2MX9 2MX9
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 13 mm 13 mm

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