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EPF10K30ABC356-2

Showing 4 Results for EPF10K30ABC356-2, including EPF10K30ABC356-2,EPF10K30ABC356-2, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
EPF10K30ABC356-2 Altera (Intel) FPGA - Field Programmable Gate Array FPGA - Flex 10K 216 LABs 246 IOs Download
EPF10K30ABC356-2 Intel IC FPGA 246 I/O 356BGA Download
EPF10K30ABC356-2N Altera (Intel) Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356 Download
EPF10K30ABC356-2N Intel Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356 Download
EPF10K30ABC356-2 Related Product Datasheets:
Part Number Datasheet
EPF10K30ABC356-2N 、 EPF10K30ABC356-2N Download Datasheet
EPF10K30ABC356-2 Download Datasheet
EPF10K30ABC356-2 Download Datasheet
EPF10K30ABC356-2 Related Products:
Part Number EPF10K30ABC356-2N EPF10K30ABC356-2N
Description Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356 Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356
Is it Rohs certified? conform to conform to
Maker Intel Altera (Intel)
package instruction LBGA, LBGA,
Reach Compliance Code compliant compliant
Other features 1728 LOGIC ELEMENTS; 216 LABS 1728 LOGIC ELEMENTS; 216 LABS
maximum clock frequency 80 MHz 80 MHz
JESD-30 code S-PBGA-B356 S-PBGA-B356
JESD-609 code e1 e1
length 35 mm 35 mm
Dedicated input times 4 4
Number of I/O lines 246 246
Number of terminals 356 356
Maximum operating temperature 70 °C 70 °C
organize 4 DEDICATED INPUTS, 246 I/O 4 DEDICATED INPUTS, 246 I/O
Output function REGISTERED REGISTERED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 245 245
Programmable logic type LOADABLE PLD LOADABLE PLD
propagation delay 0.7 ns 0.7 ns
Certification status Not Qualified Not Qualified
Maximum seat height 1.63 mm 1.63 mm
Maximum supply voltage 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
width 35 mm 35 mm

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