Part Number |
EPF10K30ABC356-2N |
EPF10K30ABC356-2N |
Description |
Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356 |
Loadable PLD, 0.7ns, CMOS, PBGA356, BGA-356 |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Intel |
Altera (Intel) |
package instruction |
LBGA, |
LBGA, |
Reach Compliance Code |
compliant |
compliant |
Other features |
1728 LOGIC ELEMENTS; 216 LABS |
1728 LOGIC ELEMENTS; 216 LABS |
maximum clock frequency |
80 MHz |
80 MHz |
JESD-30 code |
S-PBGA-B356 |
S-PBGA-B356 |
JESD-609 code |
e1 |
e1 |
length |
35 mm |
35 mm |
Dedicated input times |
4 |
4 |
Number of I/O lines |
246 |
246 |
Number of terminals |
356 |
356 |
Maximum operating temperature |
70 °C |
70 °C |
organize |
4 DEDICATED INPUTS, 246 I/O |
4 DEDICATED INPUTS, 246 I/O |
Output function |
REGISTERED |
REGISTERED |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LBGA |
LBGA |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) |
245 |
245 |
Programmable logic type |
LOADABLE PLD |
LOADABLE PLD |
propagation delay |
0.7 ns |
0.7 ns |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.63 mm |
1.63 mm |
Maximum supply voltage |
3.6 V |
3.6 V |
Minimum supply voltage |
3 V |
3 V |
Nominal supply voltage |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
Terminal form |
BALL |
BALL |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
40 |
width |
35 mm |
35 mm |