Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Intel(英特尔) |
package instruction | BGA, BGA780,28X28,40 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.7.A |
JESD-30 code | S-PBGA-B780 |
JESD-609 code | e1 |
length | 29 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 3819 |
Number of entries | 726 |
Number of logical units | 32470 |
Output times | 726 |
Number of terminals | 780 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 3819 CLBS |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA780,28X28,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 1.5,1.5/3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 3.5 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 29 mm |