Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Maxim(美信半导体) |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 256 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
length | 17 mm |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 256 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.77 mm |
Nominal supply voltage | 1.8 V |
surface mount | YES |
Telecom integrated circuit types | SUPPORT CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 17 mm |