Part Number |
DG211CSE |
DG211CSE- |
DG211CSE-2 |
Description |
Analog Switch ICs Quad SPST CMOS Analog Switches |
Low Signal Relays - PCB 1A 5VDC DPDT NON-LATCHING PCB |
Analog Switch ICs |
Is it lead-free? |
Contains lead |
- |
Contains lead |
Is it Rohs certified? |
incompatible |
- |
incompatible |
Maker |
Maxim |
- |
Maxim |
Parts packaging code |
SOIC |
- |
SOIC |
package instruction |
0.150 INCH, MS-012AC, SOIC-16 |
- |
0.150 INCH, MS-012AC, SOIC-16 |
Contacts |
16 |
- |
16 |
Reach Compliance Code |
not_compliant |
- |
not_compliant |
Analog Integrated Circuits - Other Types |
SPST |
- |
SPST |
JESD-30 code |
R-PDSO-G16 |
- |
R-PDSO-G16 |
JESD-609 code |
e0 |
- |
e0 |
length |
9.9 mm |
- |
9.9 mm |
Humidity sensitivity level |
1 |
- |
1 |
Maximum negative supply voltage (Vsup) |
-18 V |
- |
-18 V |
Negative supply voltage minimum (Vsup) |
-4.5 V |
- |
-4.5 V |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
- |
-15 V |
normal position |
NC |
- |
NC |
Number of channels |
1 |
- |
1 |
Number of functions |
4 |
- |
4 |
Number of terminals |
16 |
- |
16 |
Nominal off-state isolation |
70 dB |
- |
70 dB |
Maximum on-state resistance (Ron) |
175 Ω |
- |
175 Ω |
Maximum operating temperature |
70 °C |
- |
70 °C |
output |
SEPARATE OUTPUT |
- |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
SOP |
- |
SOP |
Encapsulate equivalent code |
SOP16,.25 |
- |
SOP16,.25 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
SMALL OUTLINE |
- |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
240 |
- |
240 |
power supply |
5,+-15 V |
- |
5,+-15 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Maximum seat height |
1.75 mm |
- |
1.75 mm |
Maximum supply voltage (Vsup) |
18 V |
- |
18 V |
Minimum supply voltage (Vsup) |
4.5 V |
- |
4.5 V |
Nominal supply voltage (Vsup) |
15 V |
- |
15 V |
surface mount |
YES |
- |
YES |
Maximum disconnect time |
500 ns |
- |
500 ns |
Maximum connection time |
1000 ns |
- |
1000 ns |
switch |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
technology |
CMOS |
- |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn85Pb15) |
- |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
- |
GULL WING |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
Terminal location |
DUAL |
- |
DUAL |
Maximum time at peak reflow temperature |
20 |
- |
20 |
width |
3.9 mm |
- |
3.9 mm |