Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | QFN |
package instruction | HVQCCN, |
Contacts | 16 |
Reach Compliance Code | unknown |
Other features | ALSO OPERATES AT +12 V SUPPLY |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | S-XQCC-N16 |
JESD-609 code | e3 |
length | 3 mm |
Humidity sensitivity level | 3 |
Maximum negative supply voltage (Vsup) | -16.5 V |
Negative supply voltage minimum (Vsup) | -13.5 V |
Nominal Negative Supply Voltage (Vsup) | -15 V |
Number of channels | 1 |
Number of functions | 4 |
Number of terminals | 16 |
Nominal off-state isolation | 75 dB |
On-state resistance matching specifications | 5 Ω |
Maximum on-state resistance (Ron) | 120 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
Maximum seat height | 0.9 mm |
Maximum supply voltage (Vsup) | 16.5 V |
Minimum supply voltage (Vsup) | 13.5 V |
Nominal supply voltage (Vsup) | 15 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | MATTE TIN |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 3 mm |