Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TQFP |
package instruction | PLASTIC, TQFP-64 |
Contacts | 64 |
Manufacturer packaging code | PN64 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 10 ns |
Other features | EASILY EXPANDABLE IN DEPTH AND WIDTH |
Maximum clock frequency (fCLK) | 66.7 MHz |
period time | 15 ns |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e0 |
length | 14 mm |
memory density | 9216 bit |
Memory IC Type | OTHER FIFO |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 512 words |
character code | 512 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512X18 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP64,.66SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.005 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 14 mm |