Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Texas Instruments(德州仪器) |
package instruction | HVBCC, |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 6 weeks |
series | 7001 |
JESD-30 code | S-PBCC-B5 |
length | 0.8 mm |
Logic integrated circuit type | BUFFER |
MaximumI(ol) | 0.012 A |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of entries | 1 |
Number of terminals | 5 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVBCC |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Maximum supply current (ICC) | 0.014 mA |
propagation delay (tpd) | 20 ns |
Maximum seat height | 0.4 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
Temperature level | AUTOMOTIVE |
Terminal form | BUTT |
Terminal location | BOTTOM |
width | 0.8 mm |