Basic information of LS709CB amplifier:
LS709CB is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP14,.3
LS709CB amplifier core information:
The minimum operating temperature of LS709CB is and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 1.5 µA
The maximum slew rate of LS709CB given by the manufacturer is 6.6 mA. Its minimum voltage gain is 14100.
The power supply range is: +-9/+-15 V. The input offset voltage of LS709CB is 10000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LS709CB:
LS709CB has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.
LS709CB amplifier additional information:
LS709CB adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LS709CB is: NO. Its temperature grade is: COMMERCIAL. LS709CB is not Rohs certified.
The corresponding JESD-30 code is: R-PDIP-T14. The packaging code of LS709CB is: DIP. The materials of LS709CB package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LS709CB package pin format is: IN-LINE.
Its terminal form is: THROUGH-HOLE.
Basic information of LS709CB amplifier:
LS709CB is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP14,.3
LS709CB amplifier core information:
The minimum operating temperature of LS709CB is and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 1.5 µA
The maximum slew rate of LS709CB given by the manufacturer is 6.6 mA. Its minimum voltage gain is 14100.
The power supply range is: +-9/+-15 V. The input offset voltage of LS709CB is 10000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LS709CB:
LS709CB has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.
LS709CB amplifier additional information:
LS709CB adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LS709CB is: NO. Its temperature grade is: COMMERCIAL. LS709CB is not Rohs certified.
The corresponding JESD-30 code is: R-PDIP-T14. The packaging code of LS709CB is: DIP. The materials of LS709CB package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LS709CB package pin format is: IN-LINE.
Its terminal form is: THROUGH-HOLE.
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | not_compliant |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 1.5 µA |
| frequency compensation | NO |
| Maximum input offset voltage | 10000 µV |
| JESD-30 code | R-PDIP-T14 |
| low-dissonance | NO |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-9/+-15 V |
| Certification status | Not Qualified |
| Maximum slew rate | 6.6 mA |
| Supply voltage upper limit | 18 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Minimum voltage gain | 14100 |
| Base Number Matches | 1 |
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