Basic information of LM4665LDX/NOPB amplifier:
Commonly used packaging methods are SON, SOLCC10,.16,20
LM4665LDX/NOPB amplifier core information:
The minimum operating temperature of the LM4665LDX/NOPB is -40 °C and the maximum operating temperature is 85 °C.
The power supply range is: 3/5 V.
Related dimensions of LM4665LDX/NOPB:
LM4665LDX/NOPB has 10 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.5 mm.
LM4665LDX/NOPB amplifier additional information:
Its temperature grade is: INDUSTRIAL. And its humidity sensitivity level is: 3. LM4665LDX/NOPB is not Rohs certified. The corresponding JESD-30 code is: R-PDSO-N10. The corresponding JESD-609 code is: e3.
The packaging code of LM4665LDX/NOPB is: SON. The materials used in the LM4665LDX/NOPB package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LM4665LDX/NOPB package pins are: SMALL OUTLINE. Its terminal forms are: NO LEAD.
Basic information of LM4665LDX/NOPB amplifier:
Commonly used packaging methods are SON, SOLCC10,.16,20
LM4665LDX/NOPB amplifier core information:
The minimum operating temperature of the LM4665LDX/NOPB is -40 °C and the maximum operating temperature is 85 °C.
The power supply range is: 3/5 V.
Related dimensions of LM4665LDX/NOPB:
LM4665LDX/NOPB has 10 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.5 mm.
LM4665LDX/NOPB amplifier additional information:
Its temperature grade is: INDUSTRIAL. And its humidity sensitivity level is: 3. LM4665LDX/NOPB is not Rohs certified. The corresponding JESD-30 code is: R-PDSO-N10. The corresponding JESD-609 code is: e3.
The packaging code of LM4665LDX/NOPB is: SON. The materials used in the LM4665LDX/NOPB package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LM4665LDX/NOPB package pins are: SMALL OUTLINE. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| package instruction | SON, SOLCC10,.16,20 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | R-PDSO-N10 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SON |
| Encapsulate equivalent code | SOLCC10,.16,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| LM4665LDX/NOPB | LM4665MMX/NOPB | LM4665MMX | LM4665ITLX/NOPB | |
|---|---|---|---|---|
| Description | IC,AUDIO AMPLIFIER,SINGLE,LLCC,10PIN,PLASTIC | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO10, MSOP-10 | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO10, MSOP-10 | IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC |
| Is it Rohs certified? | conform to | conform to | incompatible | conform to |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | SON, SOLCC10,.16,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | FBGA, BGA9,3X3,20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | R-PDSO-N10 | S-PDSO-G10 | S-PDSO-G10 | S-PBGA-B9 |
| JESD-609 code | e3 | e3 | e0 | e1 |
| Humidity sensitivity level | 3 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 10 | 10 | 10 | 9 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SON | TSSOP | TSSOP | FBGA |
| Encapsulate equivalent code | SOLCC10,.16,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | BGA9,3X3,20 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, FINE PITCH |
| power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | NO LEAD | GULL WING | GULL WING | BALL |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL | BOTTOM |
| Is Samacsys | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD