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On November 7, 2019, the Semiconductor Industry Association (SIA) elected Keith Jackson, President, CEO and Chairman of ON Semiconductor, as its 2020 Chairman and Robert Bruggeworth, President, CEO a...[Details]
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Samsung Electronics reportedly announced today that it will merge its mobile and consumer electronics divisions to focus on developing its logic chip business. The massive move is the latest sign o...[Details]
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On April 2, 2020, ProPlus Electronics Technology Co., Ltd. (hereinafter referred to as "ProPlus Electronics") announced that it has completed a round A financing of several hundred million yuan. This...[Details]
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Officials from multiple departments of the U.S. government are planning to impose new restrictions on Huawei, requiring foreign companies that use U.S. chip manufacturing equipment to obtain a U....[Details]
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describe The "pain points" of China's semiconductor industry are mainly the reliance on others for EDA tools, IP, semiconductor equipment and materials, as well as the large technological gap and l...[Details]
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British Prime Minister Rishi Sunak will announce a "semiconductor partnership" with the Japanese government during his visit to Tokyo on Thursday, as the UK seeks to reduce geopolitical risks by dive...[Details]
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According to South Korean media businesskorea, it is likely to become more difficult for Samsung Electronics to catch up with TSMC. Taiwan's Environmental Review Committee approved TSMC's new 2-na...[Details]
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On April 22, a fire broke out again in the N3 building of Renesas Electronics, a major Japanese automotive electronics manufacturer that had just announced its early resumption of work. The factory i...[Details]
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The 3nm era is here! Cadence released the 112G Ultra-Long Reach (112G-ELR) SerDes IP for TSMC's 3nm process (N3E) during the 2023 TSMC North American Technology Symposium. This is a new member of...[Details]
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According to the latest report from the Semiconductor Industry Association (SEMI), the total investment in new wafer fab construction starting in 2020 is expected to reach US$50 billion, an increase ...[Details]
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On June 30, 2023, the completion and commissioning ceremony of Xiamen Romo Electronic Technology Co., Ltd., the world's first flexible circuit board additive manufacturing mass production demonstrati...[Details]
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While Intel reported a sharp decline in fourth-quarter 2022 results, it also officially announced the suspension of its RISC-V Pathfinder program, which raised questions about its commitment to other...[Details]
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ARM has signed a three-year agreement to allow researchers at the US Defense Advanced Research Projects Agency (DARPA) to use all of its intellectual property and tools. The ARM deal specifically t...[Details]
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On April 19, SK Hynix announced that it had signed a memorandum of understanding (MOU) with TSMC to advance the development of HBM4 and next-generation packaging technology, with the goal of puttin...[Details]
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The world's first 3D packaged chip is born! On Thursday, UK-based AI chip company Graphcore released an IPU product, Bow, which uses TSMC's 7nm 3D packaging technology. It is reported that this p...[Details]