TLV2774CP

Basic information of TLV2774CP amplifier:

TLV2774CP is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP7/14,.3

TLV2774CP amplifier core information:

The minimum operating temperature of the TLV2774CP is and the maximum operating temperature is 70 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.0001 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2774CP has a nominal slew rate of 6 V/us. The maximum slew rate of the TLV2774CP given by the manufacturer is 8 mA, while the minimum slew rate is 4.7 V/us. Its minimum voltage gain is 13000. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2774CP gain becomes 0.707 times the low-frequency gain is 4800 kHz.

The nominal supply voltage of the TLV2774CP is 2.7 V. The power supply range is: 3/5 V. The input offset voltage of the TLV2774CP is 2900 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLV2774CP:

The width of TLV2774CP is: 7.62 mm and the length is 19.305 mm. TLV2774CP has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 14

TLV2774CP amplifier additional information:

TLV2774CP adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2774CP is: YES. Its temperature grade is: COMMERCIAL.

TLV2774CP is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-PDIP-T14. The packaging code of TLV2774CP is: DIP. The materials used for TLV2774CP packaging are mostly PLASTIC/EPOXY.

The package shape is RECTANGULAR. The TLV2774CP package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.