Part Number | Manufacturer | Description |
---|---|---|
TLE2061BIP | Rochester Electronics LLC | TLE2061BIP是一款OPERATIONAL AMPLIFIER。常用的包装方式为PLASTIC, DIP-8TLE2061BIP的最低工作温度是-40 °C,最高工作温度是85 °C。其峰值回流... |
Basic information of TLE2061BCP amplifier:
TLE2061BCP is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are PLASTIC, DIP-8
TLE2061BCP amplifier core information:
The minimum operating temperature of TLE2061BCP is and the maximum operating temperature is 70 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.002 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLE2061BCP is 3.4 V/us. The maximum slew rate of the TLE2061BCP given by the manufacturer is 0.34 mA, while the minimum slew rate is 2.5 V/us. Its minimum voltage gain is 500. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLE2061BCP gain becomes 0.707 times the low-frequency gain is 1300 kHz.
The nominal supply voltage of TLE2061BCP is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of TLE2061BCP is 2400 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLE2061BCP:
The width of TLE2061BCP is: 7.62 mm and the length is 9.81 mm. TLE2061BCP has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8
TLE2061BCP amplifier additional information:
TLE2061BCP adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLE2061BCP is: YES. Its temperature grade is: COMMERCIAL.
TLE2061BCP is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-PDIP-T8. The packaging code of TLE2061BCP is: DIP. The materials used for TLE2061BCP packaging are mostly PLASTIC/EPOXY.
The package shape is RECTANGULAR. The TLE2061BCP package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.
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