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TLV2432MJGB

Part NumberTLV2432MJGB
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size6308.69,34 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TLV2432MJGB Overview

Basic information of TLV2432MJGB amplifier:

TLV2432MJGB is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are CERAMIC, DIP-8

TLV2432MJGB amplifier core information:

The TLV2432MJGB has a minimum operating temperature of -55 °C and a maximum operating temperature of 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum bias current at 25°C is: 0.00006 µA Its maximum average bias current is 0.0003 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2432MJGB has a nominal slew rate of 0.25 V/us. The maximum slew rate of the TLV2432MJGB given by the manufacturer is 0.27 mA, while the minimum slew rate is 0.1 V/us. Its minimum voltage gain is 500. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2432MJGB gain becomes 0.707 times the low-frequency gain is 500 kHz.

The nominal supply voltage of the TLV2432MJGB is 3 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2432MJGB is 2500 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLV2432MJGB:

The width of TLV2432MJGB is: 7.62 mm and the length is 9.58 mm. TLV2432MJGB has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

TLV2432MJGB amplifier additional information:

TLV2432MJGB adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2432MJGB is: YES. Its temperature grade is: MILITARY.

It is a micropower amplifier. The TLV2432MJGB is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-GDIP-T8. The packaging code of TLV2432MJGB is: DIP.

The materials used in the TLV2432MJGB package are mostly CERAMIC and GLASS-SEALED. The package shape is RECTANGULAR. The TLV2432MJGB package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

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