LT6011IMS8#PBF

Basic information of LT6011IMS8#PBF amplifier:

LT6011IMS8#PBF is an OPERATIONAL AMPLIFIER from Linear Technology. Commonly used packaging methods are TSSOP, TSSOP8,.19

LT6011IMS8#PBF amplifier core information:

The minimum operating temperature of LT6011IMS8#PBF is -40 °C and the maximum operating temperature is 85 °C. Its peak reflow temperature is 260. Its maximum bias current at 25°C is: 0.0009 µA. Its maximum average bias current is 0.0015 µA.

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of LT6011IMS8#PBF is 0.11 V/us. The maximum slew rate of the LT6011IMS8#PBF given by the manufacturer is 0.8 mA, while the minimum slew rate is 0.04 V/us. Its minimum voltage gain is 250000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the LT6011IMS8#PBF gain becomes 0.707 times the low-frequency gain is 350 kHz.

The nominal supply voltage of LT6011IMS8#PBF is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of LT6011IMS8#PBF is 275 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of LT6011IMS8#PBF:

The width of LT6011IMS8#PBF is: 3 mm, and the length is 3 mm. LT6011IMS8#PBF has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.65 mm. Total pins: 8

LT6011IMS8#PBF amplifier other information:

LT6011IMS8#PBF adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It belongs to the low offset class of amplifiers. The frequency compensation status of LT6011IMS8#PBF is: YES. Its temperature grade is: INDUSTRIAL.

And its humidity sensitivity level is: 1. It is a micropower amplifier. LT6011IMS8#PBF is not Rohs certified. The corresponding JESD-30 code is: S-PDSO-G8. The corresponding JESD-609 code is: e3.

The packaging code of LT6011IMS8#PBF is: TSSOP. The materials used for LT6011IMS8#PBF packaging are mostly PLASTIC/EPOXY. The package shape is SQUARE. The LT6011IMS8#PBF package pin forms are: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING.

The maximum seat height is 1.1 mm.