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MAX4074BNEUK+T

Part NumberMAX4074BNEUK+T
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size4324.84,20 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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MAX4074BNEUK+T Overview

Basic information of MAX4074BNEUK+T amplifier:

MAX4074BNEUK+T is an OPERATIONAL AMPLIFIER. The commonly used packaging method is LSSOP,

MAX4074BNEUK+T amplifier core information:

The MAX4074BNEUK+T has a minimum operating temperature of -40 °C and a maximum operating temperature of 70 °C. Its peak reflow temperature is 260°C and its maximum average bias current is 0.001 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the MAX4074BNEUK+T has a nominal slew rate of 0.1 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the MAX4074BNEUK+T gain becomes 0.707 times the low-frequency gain is 4000 kHz.

The nominal supply voltage of the MAX4074BNEUK+T is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the MAX4074BNEUK+T is 3500 µV (Input offset voltage: the compensation voltage required between the two input terminals to make the op amp output terminal 0V (or close to 0V).)

Related dimensions of MAX4074BNEUK+T:

The width of MAX4074BNEUK+T is: 1.625 mm and the length is 2.9 mm. MAX4074BNEUK+T has 5 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.95 mm. Total pins: 5

MAX4074BNEUK+T amplifier additional information:

Its temperature grade is: OTHER. And its humidity sensitivity level is: 1. MAX4074BNEUK+T is not Rohs certified. The corresponding JESD-30 code is: R-PDSO-G5. The corresponding JESD-609 code is: e3.

The packaging code of MAX4074BNEUK+T is: LSSOP. The materials used in the MAX4074BNEUK+T package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The MAX4074BNEUK+T package pin forms are: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING.

The maximum seat height is 1.45 mm.

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