Part Number | Manufacturer | Description |
---|---|---|
TLV2422MJGB | Rochester Electronics LLC | DUAL OP-AMP, 2500 uV OFFSET-MAX, 0.046 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
TLV2422MJG | Texas Instruments | DUAL OP-AMP, 2500uV OFFSET-MAX, 0.046MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
TLV2422AMJG | Texas Instruments | DUAL OP-AMP, 1800uV OFFSET-MAX, 0.046MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
TLV2422AMJGB | Texas Instruments | DUAL OP-AMP, 1800uV OFFSET-MAX, 0.046MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
5962-9751401QPA amplifier basic information:
5962-9751401QPA is an OPERATIONAL AMPLIFIER. The commonly used packaging method is DIP,
5962-9751401QPA amplifier core information:
The minimum operating temperature of the 5962-9751401QPA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.0003 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the 5962-9751401QPA has a nominal slew rate of 0.02 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the 5962-9751401QPA gain becomes 0.707 times the low-frequency gain is 46 kHz.
The nominal supply voltage of the 5962-9751401QPA is 3 V. The upper limit of its supply voltage is 12. The input offset voltage of V5962-9751401QPA is 2500 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of 5962-9751401QPA:
The width of 5962-9751401QPA is: 7.62 mm and the length is 9.58 mm. 5962-9751401QPA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8
5962-9751401QPA amplifier additional information:
Its temperature grade is: MILITARY. And its humidity sensitivity level is: NOT SPECIFIED. 5962-9751401QPA is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-GDIP-T8.
The packaging code of 5962-9751401QPA is: DIP. The materials used in the 5962-9751401QPA package are mostly CERAMIC and GLASS-SEALED. The package shape is RECTANGULAR. The 5962-9751401QPA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
The maximum seat height is 5.08 mm.
5962-9751401QPA Also View
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