TD-SCDMA: Breaking down bottlenecks in the industry chain

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TD-SCDMA: Breaking down bottlenecks in the industry chain [Copy link]

Review of TD-SCDMA Important Events in 2006

The year 2006, which is about to pass, is of great significance to TD-SCDMA. In this peaceful yet turbulent year, we have witnessed the breakthroughs made by TD-SCDMA one after another:

On January 20, the Ministry of Information Industry announced TD-SCDMA as the Chinese communications industry standard;

On March 12, the TD-SCDMA scale test plan was officially finalized. China Telecom, China Mobile and China Netcom, the three major operators, respectively selected Baoding, Xiamen and Qingdao for TD-SCDMA scale test.

On June 30, the Ministry of Information Industry issued an announcement stating that 21 projects have been identified as projects funded by the Ministry of Information Industry, among which TD-SCDMA occupies an important position. The funding includes the research and development and industrialization of TD-SCDMA smartphone embedded operating systems, the industrialization of TD-SCDMA core technologies and terminal products, and the development and industrialization of TD-SCDMA enhanced technology (HSDPA) products.

In early August, the first phase of TD-SCDMA large-scale testing was completed;

In October, the first round of testing of the third phase of TD-SCDMA was completed;

On November 5, TD-SCDMA entered the stage of releasing numbers to friendly users.

System manufacturers and terminal manufacturers jointly appeared

The TD-SCDMA exhibition area in Hall 2 of the 2006 ITU Telecom Exhibition was very lively. Major domestic TD system manufacturers such as China Putian, Datang Mobile, ZTE, and TD Tech all gathered here, not only displaying their mature TD-SCDMA system products, but also displaying the subsequent evolution of HSDPA systems. ZTE launched the latest "BBU+RRU" solution and second-generation distributed base station products; Datang displayed HSDPA super 3G technology based on TD-SCDMA standard; TD Tech exhibited its NodeB450, NodeB610 and RNC810 products and medium-frequency remote outdoor unit products at this telecommunications exhibition.

Most of the terminal manufacturers who participated in the TD-SCDMA commercial test displayed their TD-SCDMA terminal products at the ITU World Telecom Exhibition. ZTE, Inventec and others have special TD-SCDMA terminal display areas. ZTE exhibited two TD-SCDMA mobile phones, namely U350 and seamless dual-mode U80; BenQ exhibited its TD-SCDMA standard S82; Inventec exhibited a TD-SCDMA/GSM dual-mode mobile phone, T21; Datang Mobile exhibited a newly launched TD-SCDMA/GSM dual-mode mobile phone. In addition, Samsung, Bird, Lenovo and other manufacturers also displayed their TD-SCDMA mobile phones that passed the test. The TD-SCDMA Alliance has broken the bottleneck that affects the development of the TD-SCDMA industry chain with its gradually improved systems and terminal products.

According to the manufacturers' plans, future TD-SCDMA terminals will, like WCDMA terminals, support various new services such as positioning, streaming media, one-touch talk, video calls, mobile TV, and service platforms such as WAP and JAVA. Among them, TD-SCDMA terminals have more advantages in positioning services and asymmetric data transmission services.

Powerful beating "TD core"

Just like the gradual development and improvement of system and terminal manufacturers, TD-SCDMA chip manufacturers, as an important part of the TD industry chain, are also promoting the healthy development of the TD industry chain and fully preparing for the comprehensive test of TD commercialization. Tiantian, Spreadtrum and Kaiming, three chip companies, also displayed their RF and baseband chips at the ITU World Telecom Exhibition, and all provided complete TD-SCDMA terminal solutions on this basis; ADI released the second-generation chipset based on the TD-SCDMA low chip rate (LCR) air interface for advanced multimedia mobile phone manufacturers.

TD-SCDMA chips mainly include radio frequency chips and baseband chips. Currently, there are three companies involved in the research and development of TD-SCDMA radio frequency chips: RDA Microelectronics, Dingxin and Guangzhou Guangsheng. There are six manufacturers developing TD-SCDMA baseband chips: Spreadtrum, Commit, T3G, Datang Mobile, Chongqing Post and Information Technology and Huali.

T3G's TD-SCDMA chip features dual-mode, and the corresponding dual-mode chip terminal can standby for up to 100 hours at 800mA current, and talk time can last for 2 hours. In addition to the chipset, T3G also launched dual-mode protocol stack software and dual-mode terminal reference design.

Spreadtrum's chips are also TD-SCDMA/GSM/GPRS multi-mode single chips, the core chip of which is the baseband chip SC8800-289, which integrates GSM analog and digital baseband, TD-SCDMA analog and digital baseband and power management functions. The RF part uses Maxim's chips, and the modulation and demodulation functions are realized through the internal chip. In the laboratory stage, 384Kbit/s high-speed packet data transmission can be achieved. Currently, it is used in Dibit S300, Inventec k933, Hisense HT26, Amoi and Lenovo mobile phones. Spreadtrum Communications has listed HSDPA as a development focus and plans to launch a chipset supporting HSDPA in 2007.

The single-mode TD-SCDMA chipset launched by Kaiming is based on TI and Commit dual-logo chips, including digital baseband chips, analog baseband chips with power management, and RF transceivers, as well as Kaiming's own intellectual property hardware accelerator chips as baseband coprocessors. The chips have been used in Boway T08, Dibit 2906, LGT15 and Lenovo mobile phones.

The chips launched by Chongqing University of Posts and Telecommunications are mainly digital baseband chips, while the RF and analog baseband chips will be provided by Maxim.

In October 2006, Shanghai Dingxin Communications announced the launch of its self-developed TD-SCDMA RF and analog baseband engineering samples, which it said was "the world's first CMOS TD-SCDMA RF chipset that has reached international advanced levels". At the same time, Shanghai RDA Microelectronics, a local communications microelectronics company backed by the US venture capital firm Warburg Pincus, released a TD-SCDMA standard RF chip and planned to start mass production in January or February 2007.

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International standards are hard to come by, so we should give full support. May China TD continue to move forward.