What are the differences in usage between IC green products and ordinary products?

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What are the differences in usage between IC green products and ordinary products? [Copy link]

Sn), which affects the increase of the peak temperature and duration of the reflow process, which may cause the plastic package colloid to rupture due to local high temperature during the reflow process of the plastic package IC, and may also cause the internal welding wire to break due to the violent expansion of the colloid. This will increase the defective rate of welding. If the temperature curve of the reflow soldering is not set properly, it will also cause the problem of poor welding. This is more obvious for packaging forms such as QFN and BGA. Therefore, users must carefully adjust the welding process of such products (temperature and time settings of different solder paste components) to ensure the quality and efficiency of welding.